ZM30L PCB Automatic Round Knife Depaneling Machine

The ZM30L PCB Automatic Round Knife Depaneling Machine by SEPRAYS showcases advanced technology tailored for high-precision and damage-free separation of printed circuit boards (PCBs). Its distinctive features emphasize quality, precision, and reduced stress on the PCBs during the depaneling process.

Features

1. Multi-Stage Cutting Technology
Utilizes three distinct cutting units (A, B, and C) that operate in sequential stages, allowing for refined, controlled cuts that ensure smoother surfaces and reduced risk of board damage.

2. Reduced Cutting Stress
The multi-stage cutting process lowers cutting stress by more than 80%, significantly minimizing the chance of PCB deformation, which is critical for maintaining board functionality and appearance.

3. Superior Edge Finish
Ensures flat, burr-free board edges and prevents surface warping or twisting, meeting the high precision requirements of advanced circuit board applications.

4. High Production Efficiency
Designed for walkaway operation with minimal manual intervention, making it ideal for improving throughput and consistency in high-volume, high-value PCBA production lines.

5. Ideal for Sensitive Electronics
Particularly suited for depaneling sensitive or high-specification PCBs used in industries where reliability and durability are essential, such as medical, aerospace, or automotive electronics.

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Specifications

Model ZM30-L
Cutting length Unlimited length
Thickness 0.5~3mm
Circuit board type Aluminum substrate, Copper substrate, FR1~4, Glass fiber plate
Feeding speed 0~400mm/s
Machine size (mm) 325*380*333
Inlet/outlet tray table size (mm) 1200*506*333 / 2400*506*333
Blade type SKH high speed steel
Weight 33 kg + 6kg(1200mm) +15kg(2400mm)
Power 230V/50HZ,110V/60W
Hourly workload 800
en_USEnglish
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