FPC/PCB Laser Separator with 18W UV Laser Head for PCBA and FPCA Applications

Features

1. Stress-Free Depaneling

   • Utilizes non-contact laser cutting, eliminating mechanical stress on the PCB and its components.

   • Prevents stress-induced damage such as cracks, ensuring higher quality and better reliability of the final product.

2. Stationary Laser Assembly

   • The laser’s focal point remains fixed during operation.

   • Ensures consistently accurate cuts that are unaffected by machine or motor wear.

3. Significant Dust Reduction

   • Laser routing drastically reduces dust compared to conventional router bits or saw blades.

   • Eliminates the need for post-processing cleanup.

   • Prevents contamination or failure due to leftover particles on the PCB.

4. Dual Shuttle In-Feed System

   • Enables high-speed operation by allowing quick in-and-out PCB movement.

   • Can process one PCB at high speed or two different PCBs with separate programs simultaneously.

   • Cycle time for PCB shuttling is under 2 seconds.

   • Simultaneous dual-program operation reduces changeover time to zero.

5. High-Precision Linear Motor Control on All Axes

   • Every axis uses advanced linear motor technology.

   • Delivers ultra-fast and precise movements for enhanced cutting accuracy and throughput.

Specifications