330×320mm Dual-Workarea Laser Depaneling Machine — High-Speed Operation at 2500mm/s with Excellent Cut Quality

Features

• Product Name: Laser Depaneling Machine
  – A specialized machine designed for precise laser-based PCB separation.

• Cutting Material: Various Materials
  – Capable of processing a wide range of materials, offering broad application flexibility.

• Operating Environment: Friendly Environment
  – Designed to operate in standard manufacturing conditions without requiring special setup.

• Max. Working Area:
  – Standard: 300 × 300 × 11 mm
  – Custom Option: 400 × 300 mm (Customizable to meet specific production needs)

• Function: Depaneling FR4 / FPC
  – Suitable for cutting both rigid (FR4) and flexible (FPC) circuit boards.

• Advantages:
  – Auto Vision Positioning: Uses visual recognition for precise alignment and accurate cutting.
  – Excellent Cut Finish: Delivers smooth, clean edges with minimal thermal impact or debris.

Applications

The Laser Depaneling Machine is a high-performance PCB cutting solution designed for fast, precise processing of various materials. Certified with a CE Certificate, it is a reliable choice for both industrial and commercial applications.

This machine is available with laser power options of 10W, 12W, 15W, or 18W at 30kHz, and features a maximum working area of 300 × 300 × 11 mm or 400 × 300 mm (customizable upon request). It offers a maximum scanning speed of 2500 mm/s, ensuring high-efficiency production.

The Laser Depaneling Machine is available with a minimum order quantity of one set and comes at a negotiable competitive price. Each unit is securely packaged in a plywood case, with a delivery time of within 10 days.

Accepted payment terms include T/T, Western Union, and L/C, and the company has a monthly production capacity of up to 260 sets.

Specifications