DirectLaser S2 PCB/FPC Laser Cutting Machine

Features

• High-Precision Cutting
  The DirectLaser S2 is engineered for high-precision cutting, making it suitable for small-format equipment and complex PCB or FPC designs.

• Minimal Stress Induction
  Laser cutting introduces no mechanical stress to nearby components, even when they are positioned very close to the cutting path—ideal for densely packed assemblies.

• Thermal Impact Minimization
  The system automatically selects the optimal laser type and processing parameters based on the thermal sensitivity of the material, reducing heat-related damage.

• Clean Processing
  Equipped with real-time exhaust for gases and laser debris, the machine maintains a clean work environment and minimizes contamination, ensuring precise cuts.

• Standard Offline SMT PCB Separation
  Designed for standard offline applications in SMT PCB separation, making it easy to integrate into existing manufacturing workflows.

• Stable Granite Platform
  Built on a granite base, the machine provides enhanced structural stability, improving cutting accuracy and long-term reliability.

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Specifications