Features
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Precision and Speed: Achieves repeatability of ±2μm and cutting precision of ±25μm, with a 1μm X/Y resolution, enabling fast and highly accurate operations.
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Clean Processing: Utilizes advanced heat control technology to ensure burr-free and clean cuts, making it ideal for intricate PCB designs.
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Versatile Compatibility: Capable of cutting materials up to 2mm thick, supporting a wide range of applications beyond just PCBs.
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User-Friendly Software: Operated through DreamCreaTor 3 and Circuit CAM7.5 Standard software, offering a simplified and intuitive user experience.
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Safety Features: Equipped with built-in safety mechanisms that protect both the operator and the equipment during operation.
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Flexible Design: Features a single-platform setup with a 300×350mm processing area, suitable for high-precision and compact projects.
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CCD Vision System: Integrated 130-megapixel CCD camera ensures precise alignment and accurate cutting based on visual guidance.
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Specifications
Item | DirectLaser H1 |
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Platform Type | Single Platform |
Processing Area | 300*350mm |
Repeatability | ±2μm |
Overall Precision | ±25μm |
X/Y Resolution | 1μm |
Material Thickness | ≤2.0mm |
Platform Structure | Steel Structure |
Motor Type | Servo Motor |
Laser Type | Nanosecond |
Laser Power | 15W |
Telecentric Lens Range | 50*50mm f=100mm, Domestic Galvanometer |
CCD System | Axial-parallel |
Positioning Accuracy | 0.01mm |
Camera Resolution | 130MP |
Control Software | DreamCreaTor 3 |
Data Processing Software | Circuit CAM7.5 Standard |
File Formats | LMD, Standard Gerber (RS-274-D), Extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++ |
Operating Environment | 22°C ±2°C |
Power Supply | 380VAC/50Hz/2KW |
Weight | Approx. 580kg |
Dimensions (LWH) | 93012701600mm |