ZAM330 Double Platform Laser Depaneling Machine

The ZAM330 Double Platform Laser Depaneling Machine features a spacious processing area of 350 mm × 520 mm, making it ideal for a wide range of PCB depaneling applications.

Features

●Dual-Table Design for Continuous Processing
The dual worktable configuration reduces loading and unloading time, allowing the laser to remain continuously in the processing state and improving overall efficiency.

●Large Processing Area
Offers a spacious processing area of 350 mm × 520 mm, suitable for a wide range of PCB depaneling tasks.

●Adapted for SMT Industry Applications
Ideal for processes such as depaneling pre-placed PCBs and opening cover film windows in SMT production lines.

●Optional Camera Target Pre-Positioning System
Can be equipped with a camera-based target alignment system to reduce positioning time and increase productivity.

Optional

  • UV laser 15w, 20w, 25w or Green laser 35w, 60w
  • Laser Height Sensor
  • Barcode reader and MES system integration
  • Laser cam power detection
  • upgrade to Inline

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Specifications

Model ZAM330
Vaild cutting size 350mm×520mm
Cutting function Tweening to staight line,L shape,U shape,Circle,Arc
Process table Two
Repeat precision ±2μm
Cutting precision ±20μm
Ambient Temperatur 22℃±2℃(71.6℉±2℉)
Platform Marble  table
Transfer model(option) Mechanical transfer arm(scrap board throwing)
Laser wavelength 355nm/532nm
Receive Data Forma Gerber, HPGL, Sieb & Meier, Excellon, ODB++
Operation system Windows 7 / Windows 10
Target reads CCD automatic target capture Target shape is irregular, 

no Target, DIL is required Modules

Cutting software DreamCreaTor
Data processing software CircuitCAM 7
XYZ-axis driving mode linear +servo motor
Voltage/Power requirement AC380V 50/60Hz 2.5KW three phase
Pneumatic pressure requirement 0.6MPa,50L/min
Dimensions(W*D*H) 1600mm x2100mm x1600mm
Weight 2000KG

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