Features
●Dual-Table Design for Continuous Processing
The dual worktable configuration reduces loading and unloading time, allowing the laser to remain continuously in the processing state and improving overall efficiency.
●Large Processing Area
Offers a spacious processing area of 350 mm × 520 mm, suitable for a wide range of PCB depaneling tasks.
●Adapted for SMT Industry Applications
Ideal for processes such as depaneling pre-placed PCBs and opening cover film windows in SMT production lines.
●Optional Camera Target Pre-Positioning System
Can be equipped with a camera-based target alignment system to reduce positioning time and increase productivity.
Optional
- UV laser 15w, 20w, 25w or Green laser 35w, 60w
- Laser Height Sensor
- Barcode reader and MES system integration
- Laser cam power detection
- upgrade to Inline
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Specifications
Model | ZAM330 |
---|---|
Vaild cutting size | 350mm×520mm |
Cutting function | Tweening to staight line,L shape,U shape,Circle,Arc |
Process table | Two |
Repeat precision | ±2μm |
Cutting precision | ±20μm |
Ambient Temperatur | 22℃±2℃(71.6℉±2℉) |
Platform | Marble table |
Transfer model(option) | Mechanical transfer arm(scrap board throwing) |
Laser wavelength | 355nm/532nm |
Receive Data Forma | Gerber, HPGL, Sieb & Meier, Excellon, ODB++ |
Operation system | Windows 7 / Windows 10 |
Target reads | CCD automatic target capture Target shape is irregular,
no Target, DIL is required Modules |
Cutting software | DreamCreaTor |
Data processing software | CircuitCAM 7 |
XYZ-axis driving mode | linear +servo motor |
Voltage/Power requirement | AC380V 50/60Hz 2.5KW three phase |
Pneumatic pressure requirement | 0.6MPa,50L/min |
Dimensions(W*D*H) | 1600mm x2100mm x1600mm |
Weight | 2000KG |